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Index of Affiliations
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Affiliation
Paper title
Helsinki University of Technology
Dynamic Modelling and Simulation of Microelect...
 
Compact Model for the Squeezed-Film Damping In...
 
Electromechanical Analysis of Micromechanical ...
 
Compact Damping Models for Lateral Structures ...
 
Model for Flow Resistance of a Rare Gas Accoun...
 
Extending the Validity of Existing Squeezed-Fi...
 
A Method for Solving Arbitrary MEMS Perforatio...
 
Analytic Damping Model for a Square Perforatio...
 
A Method for Solving Arbitrary MEMS Perforatio...
 
Acoustic Impedance Elements Modeling Oscillati...
 
Extending the Validity of Existing Squeezed-Fi...
 
Analytic Damping Model for a Square Perforatio...
Hewlett Packard Co. Laboratories
Inkjet Assisted Micro-Scale Cooling of Electro...
 
Inkjet Assisted Micro-Scale Cooling of Electro...
Hewlett Packard Laboratories
Resolution Enhancement in Nanoimprinting by Su...
 
Resolution Enhancement in Nanoimprinting by Su...
High Performance Technologies, Inc.
Multiscale Detection of Temporal Features in M...
 
Multiscale Detection of Temporal Features in M...
Hiroshima University
Silylation Hardening for Mesoporous Silica Zeo...
 
The Si-tag for Immobilizing Proteins on a Sili...
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