First International Conference on Modeling and Simulation of Microsystems, Semiconductors, Sensors and Actuators

The primary goal of this conference is to bring together researchers, designers, programmers and vendors involved in microsystem developments (microelectronic, semiconductor, sensor and actuators) to facilitate cross fertilization of ideas and exchange of information. In an effort to dramatically shorten the development time and to considerably reduce prototyping costs, the simulation activities have lately experienced a phenomenal growth, generating a large number of point solutions and tools. MSM intends to emphasize a unified viewpoint, addressing issues of mutual interest and encouraging bridges between adjacent specialities. MSM will provide a forum for microsystem simulation specialists, allowing them to be exposed to the state of the art modeling techniques currently implemented in academic or industrial research, facilitating a free exchange of ideas and generating synergies towards a complete software and system integration solution.

The conference will also provide an annual location for the demonstration of new software solutions as they relate to the focus topics. Finally, MSM will strive to help the advanced modeling techniques diffuse into industry and research centers by organizing workshops, demonstrations and shortcourses.

The conference intends to provide an arena for analyses, discussions and decisions about how to develop interdependent software packages, how to establish interfaces and cooperation strategies and how to deploy simulation methods progressing towards efficient modeling of complete microsystems. The following non-exclusive list includes the main Topics and Application Areas that would help in the progression towards the stated objectives:

• Mathematical Modeling and Scaling Laws
• Numerical Methods
• Finite and Boundary Element Methods
• Process, Device and Circuit Simulation
• Model Calibration and Validation
• Equipment Modeling
• Computational Materials
• Co-simulation and Optimization
• System and Multi-level Modeling
• Artificial Intelligence and Expert Systems
• Virtual Reality and Computer Vision
• Data Bases, Data Exchange and Translators

• Semiconductors and Microelectronics
• Advanced Packaging and Interconnects
• Micro Electro Mechanical Systems
• Smart Sensors and Structures
• Advanced Lithography and Photonics
• Bioengineering and Genomics
• Microfluidic Systems
• Environmental Monitoring
• Metrology
• Manufacturing and Scheduling
• CAD/CAE/CAM

	IEEE Electron Devices Society
	Swiss Federal Institute of Technology of Lausanne
	International Association for Mathematical and Computer Modelling
	TIMA-CMP Laboratory, France

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